Sharp to Introduce Industry’s Thinnest*1 CMOS Camera Module with Optical Image Stabilization for Smartphones
posted Friday, December 2, 2011 at 2:27 PM EST
Sharp Corporation has developed a 12.1-Megapixel, 1/3.2-type CMOS camera module with optical image stabilization that features the industry’s thinnest profile (5.47 mm in height). The new RJ63YC100 is intended for use in mobile devices such as smartphones. Sample shipments will begin from December 2, 2011.
The new module’s thin profile has been developed in response to the demand for portable mobile devices with ever more slender designs. The module also addresses the need for embedded cameras in these devices to deliver superior image quality and camera functionality, including connectivity to AV equipment and personal computers.
RJ63YC100 12.1-megapixel, 1/3.2-inch CMOS camera module with optical image stabilization.
Photo and caption provided by Sharp Corp.
The optical image stabilizer in this camera module uses a lens-shift system to control the lens inside the module. Sharp’s proprietary high-density packaging technology has made it possible to achieve the industry’s thinnest profile in this type of camera module, which is expected to help reduce the thickness of mobile devices such as smartphones.
High-quality images can be captured in a wide variety of situations that are typically prone to blurring caused by camera shake, such as shooting under dim light conditions or shooting moving subjects. The module also supports full HD (1080p) video capture, which enables smartphone owners to take high-definition video with reduced blurring and transfer the video to an LCD TV for viewing on a large screen.
|Product name||12.1-Megapixel, 1/3.2-type CMOS camera module|
|Sample price (tax included)||12,000 yen|
|Sample shipments begin||December 2, 2011|
|Volume shipments||January 10, 2012|
|Monthly production||100,000 units|
Industry’s thinnest profile (5.47 mm in height) for a CMOS camera module with optical image stabilization.
Supports full HD (1080p) video capture
|Imaging element||12.1-Megapixel, 1/3.2-type back-illuminated CMOS image sensor|
|Module dimensions (including flexible PCB)||11.0 (W) x 11.0 (L) x 5.47 (H) mm|
|Optical functions||Optical image stabilization; autofocus|
|Output format||RAW (4-lane MIPI*2 serial output interface)|
|Lens F number||F 2.5; horizontal viewing angle: 61°|
As of December 1, 2011. For 12.1-Megapixel, 1/3.2-type CMOS camera modules with optical image stabilizer (based on Sharp research).
Mobile Industry Processor Interface; MIPI is a specification for the interface between host processors and imaging peripherals/processors in mobile devices.
The following information is true and accurate at the time of publication. Manufacture, sale, price and specifications of products may be subject to change.